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| 1. product profile 1.1 general description the devices are a family of 4-, 6- and 8-chan nel rc low pass filters which are designed to provide filtering of undesired rf signals on the i/o ports of portable communication or computing devices. in additi on the devices incorporate diodes to provide protection to downstream components from electrostatic discharge (esd) voltages up to 20 kv. the pemixcsp family is fabricated using m onolithic silicon techno logy and in tegrates up to eight resistors and 16 protection diodes in a single wafer level chip-size package (wlcsp). these features make the devices ideal for us e in applications requiring the utmost in miniaturization such as mobile phone handsets , cordless telephones and personal digital devices. 1.2 features and benefits ? pb-free, restriction of hazardous substanc es (rohs) compliant and free of halogen and antimony (dark green compliant) ? integrated 4-, 6- and 8-channel -type rc filter network ? channel series resistance r s(ch) =100 ? channel capacitance c ch = 23 or 30 pf at v bias(dc) =2.5v ? channel capacitance c ch = 41 or 54 pf at v bias(dc) =0v ? available in 10, 15 and 20-ball wlcsp ? esd protection up to 20 kv contact discharge according to iec 61000-4-2, far exceeding level 4 1.3 applications general-purpose electromagnetic inte rference (emi) and radio-frequency interference (rfi) filtering and downstream esd protection for: ? cellular phone and personal communication systems (pcs) mobile handsets ? cordless telephones ? wireless data (wan/lan) systems pemixcsp family integrated 4-, 6- and 8-channel passive filter network with esd protection rev. 1 ? 3 february 2011 product data sheet
pemixcsp_fam all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 3 february 2011 2 of 16 nxp semiconductors pemixcsp family 4-, 6- and 8-channel passive filter network with esd protection 2. pinning information 2.1 pinning 2.2 pin description fig 1. pemi4csp: pin configuration fig 2. pemi6csp: pin configuration fig 3. pemi8csp: pin configuration 001aak06 2 transparent top view, solder balls facing down bump a1 index area a b c b1 2 1 b2 4 3 transparent top view, solder balls facing down bump a1 index area a b c b1 2 1 b2 4 3 001aak06 3 b3 6 5 transparent top view, solder balls facing down bump a1 index area a b c b1 2 1 b2 4 3 b3 6 5 001aak06 4 b4 8 7 table 1. pinning pin description pemi4csp pemi6csp pemi8csp a1 and c1 a1 and c1 a1 and c1 filter channel 1 a2 and c2 a2 and c2 a2 and c2 filter channel 2 a3 and c3 a3 and c3 a3 and c3 filter channel 3 a4 and c4 a4 and c4 a4 and c4 filter channel 4 - a5 and c5 a5 and c5 filter channel 5 - a6 and c6 a6 and c6 filter channel 6 - - a7 and c7 filter channel 7 - - a8 and c8 filter channel 8 b1 and b2 b1, b2 and b3 b1, b2, b3 and b4 ground (gnd) pemixcsp_fam all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 3 february 2011 3 of 16 nxp semiconductors pemixcsp family 4-, 6- and 8-channel passive filter network with esd protection 3. ordering information 4. functional diagram table 2. ordering information type number package name description version pemi4csp/rt wlcsp10 wafer level ch ip-size package; 10 bumps; 1.56 1.05 0.61 mm pemi4csp/rt pemi4csp/rw wlcsp10 wafer level ch ip-size package; 10 bumps; 1.56 1.05 0.61 mm pemi4csp/rw pemi6csp/rt wlcsp15 wafer level ch ip-size package; 15 bumps; 2.36 1.05 0.61 mm pemi6csp/rt pemi6csp/rw wlcsp15 wafer level ch ip-size package; 15 bumps; 2.36 1.05 0.61 mm pemi6csp/rw pemi8csp/rt/p wlcsp20 wafer level chip-size package; 20 bumps; 3.16 1.05 0.61 mm pemi8csp/rt/p pemi8csp/rw/p wlcsp20 wafer level chip-size package; 20 bumps; 3.16 1.05 0.61 mm pemi8csp/rw/p fig 4. pemi4csp: schematic diagram f ig 5. pemi6csp: sc hematic diagram fig 6. pemi8csp: schematic diagram 018aaa07 7 r s(ch) c ch c1 to c4 gnd a1 to a4 2 c ch 2 018aaa07 8 r s(ch) c ch c1 to c6 gnd a1 to a6 2 c ch 2 018aaa07 9 r s(ch) c ch c1 to c8 gnd a1 to a8 2 c ch 2 pemixcsp_fam all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 3 february 2011 4 of 16 nxp semiconductors pemixcsp family 4-, 6- and 8-channel passive filter network with esd protection 5. limiting values [1] device is qualified with 1000 pulses of 15 kv contact discharges each, according to the iec 61000-4-2 model and far exceeds the specified level 4 (8 kv contact discharge). 6. characteristics [1] guaranteed by design. [2] according to iec 61000-4-5 and iec 61000-4-9. table 3. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +5.6 v v esd electrostatic discharge voltage all pins to ground [1] contact discharge - 20 kv air discharge - 30 kv iec 61000-4-2, level 4 all pins to ground contact discharge - 8kv air discharge - 15 kv i ch channel current (dc) t amb =70 c-33ma p ch channel power dissipation continuous power; t amb =70 c -60mw p tot total power dissipation continuous power; t amb =70 c -250mw t stg storage temperature ? 55 +150 c t amb ambient temperature ? 40 +85 c table 4. channel characteristics t amb =25 c; unless otherwise specified. symbol parameter conditions min typ max unit r s(ch) channel series resistance 80 100 120 c ch channel capacitance for the total channel; f = 100 khz [1] pemixcsp/rt v bias(dc) =0v 182328pf v bias(dc) =2.5v - 41 - pf pemixcsp/rw v bias(dc) =0v 243036pf v bias(dc) =2.5v - 54 - pf v br breakdown voltage positive clamp; i i =1ma 5.8 - 9 v v f forward voltage negative clamp; i f =1ma ? 1.5 - ? 0.4 v i lr reverse leakage current per channel; v i = 3.5 v - - 0.1 a r dyn dynamic resistance i = 1 a [2] positive transient - 0.3 - negative transient - 0.85 - pemixcsp_fam all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 3 february 2011 5 of 16 nxp semiconductors pemixcsp family 4-, 6- and 8-channel passive filter network with esd protection 7. application information 7.1 insertion loss the devices are designed as emi/rfi filters for multichannel interfaces. all measurements were performed in a typical 50 network analyzer (nwa) setup as shown in figure 7 . the measured insertion loss in a 50 system is depicted in figure 8 . table 5. frequency characteristics t amb =25 c; unless otherwise specified. symbol parameter conditions min typ max unit il insertion loss r source =50 ; r l =50 pemixcsp/rt 800 mhz < f i <3ghz 25 30 - db f i =1.7ghz - 35 - db pemixcsp/rw 800 mhz < f i <3ghz 27 32 - db f i =1.7ghz - 37 - db ct crosstalk attenuation r source =50 ; r l =50 ; 800 mhz < f i <3ghz -30-db f ? 3db cut-off frequency r source =50 ; r l =50 pemixcsp/rt - 128 - mhz pemixcsp/rw - 98 - mhz fig 7. frequency response setup 018aaa07 4 50 v gen 50 dut out in pemixcsp_fam all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 3 february 2011 6 of 16 nxp semiconductors pemixcsp family 4-, 6- and 8-channel passive filter network with esd protection 7.2 use cases the selection of one of the filter device has to be performed in dependence of the maximum clock frequency, the driver strength, the capacitive load of the sink and the maximum applicable rise and fall times. 7.3 lcd interf aces, medium-speed interfaces for digital interfaces such as liquid crys tal display (lcd) interfac es running at clock speeds between 10 mhz and 25 mhz or more, the devices can be used in dependence of the sink load, the clock speed, the driver strength and the rise and fall time requirements. the minimum emi filter requirements may be an important factor, too. 7.4 keypad, low-speed interfaces especially for lower-speed interfaces such as keypads, low-speed serial interfaces and low-speed control signals, the pemixcsp family offers a very robust esd protection and strong suppression of unwanted frequencies (e mi filtering). due to their small size the devices can easily be spread on a printed-circuit board (pcb) in order to move the esd and emi protection close to the part of the design which shall be protected. (1) pemixcsp/rt (2) pemixcsp/rw fig 8. frequency response curves 018aaa080 ? 40 ? 20 0 s 21 (db) ? 60 f (mhz) 10 ? 1 10 4 10 3 110 2 10 (1) (2) pemixcsp_fam all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 3 february 2011 7 of 16 nxp semiconductors pemixcsp family 4-, 6- and 8-channel passive filter network with esd protection 8. marking all dies are laser-ma rked with the following information (see figure 9 and 10 ): ? a marker indicating the pin a1 position. ? two lines of characters or numbers: ? the first line (placeholder pemixcsp_fam all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 3 february 2011 8 of 16 nxp semiconductors pemixcsp family 4-, 6- and 8-channel passive filter network with esd protection 9. package outline fig 11. package outline pemi4csp (wlcsp10) wlcsp10_4-2-4_po european projection w lcsp10: wafer level chip-size package; 10 bumps (4-2-4) detail x a a 2 a 1 x a b c e d e 2 e 1 b2 b1 bump a1 index area e b 4 3 e 3 2 1 1/2 e table 7. package outline dimensions of pemi4csp symbol min typ max unit a 0.570.610.65mm a 1 0.18 0.20 0.22 mm a 2 0.39 0.41 0.43 mm b 0.210.260.31mm d 1.511.561.61mm e 1.001.051.10mm e- 0.4- mm e 1 -0.346-mm e 2 -0.692-mm e 3 -0.8-mm pemixcsp_fam all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 3 february 2011 9 of 16 nxp semiconductors pemixcsp family 4-, 6- and 8-channel passive filter network with esd protection fig 12. package outline pemi6csp (wlcsp15) wlcsp15_6-3-6_po european projection w lcsp15: wafer level chip-size package; 15 bumps (6-3-6) detail x a a 2 a 1 d e bump a1 index area x e 2 e e 1 e 3 b 12 4 36 5 a b c 1/2 e b1 b2 b3 table 8. package outline dimensions of pemi6csp symbol min typ max unit a 0.570.610.65mm a 1 0.18 0.20 0.22 mm a 2 0.39 0.41 0.43 mm b 0.210.260.31mm d 2.312.362.41mm e 1.001.051.10mm e- 0.4- mm e 1 -0.346-mm e 2 -0.692-mm e 3 -0.8-mm pemixcsp_fam all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 3 february 2011 10 of 16 nxp semiconductors pemixcsp family 4-, 6- and 8-channel passive filter network with esd protection fig 13. package outline pemi8csp (wlcsp20) wlcsp20_8-4-8_po european projection w lcsp20: wafer level chip-size package; 20 bumps (8-4-8) detail x a a 2 a 1 d e bump a1 index area e 2 e e 1 e 3 b 3 2 16 5 48 7 a b c 1/2 e x b1 b2 b3 b4 table 9. package outline dimensions of pemi8csp symbol min typ max unit a 0.570.610.65mm a 1 0.18 0.20 0.22 mm a 2 0.39 0.41 0.43 mm b 0.210.260.31mm d 3.11 3.16 3.21 mm e 1.001.051.10mm e- 0.4- mm e 1 -0.346-mm e 2 -0.692-mm e 3 -0.8-mm pemixcsp_fam all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 3 february 2011 11 of 16 nxp semiconductors pemixcsp family 4-, 6- and 8-channel passive filter network with esd protection 10. design and asse mbly recommendations 10.1 pcb design guidelines it is recommended, for optimum performance, to use a non-solder mask defined (nsmd), also known as a copper-d efined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. this results in the lowest possible ground inductance and provides the best high frequency and esd performance. refer to table 10 for the recommended prin ted-circuit board (pcb) design parameters. 10.2 pcb assembly guidelines for pb-free soldering table 10. recommended pcb design parameters parameter value or specification pcb pad diameter 250 m micro-via diameter 100 m (0.004 inch) solder mask aperture diameter 325 m copper thickness 20 m to 40 m copper finish auni pcb material fr4 table 11. assembly recommendations parameter value or specification solder screen aperture diameter 290 m solder screen thickness 100 m (0.004 inch) solder paste: pb-free snag (3 % to 4 %) cu (0.5 % to 0.9 %) solder to flux ratio 50 : 50 solder reflow profile see figure 14 pemixcsp_fam all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 3 february 2011 12 of 16 nxp semiconductors pemixcsp family 4-, 6- and 8-channel passive filter network with esd protection the device is capable of withstanding at least three reflows of this profile. fig 14. pb-free solder reflow profile table 12. characteristics symbol parameter conditions min typ max unit t reflow(peak) peak reflow temperature 230 - 260 c t 1 time 1 soak time 60 - 180 s t 2 time 2 time during t 250 c--30s t 3 time 3 time during t 230 c10 - 50 s t 4 time 4 time during t > 217 c 30 - 150 s t 5 time 5 - - 540 s dt/dt rate of change of temperature cooling rate - - ? 6 c/s pre-heat 2.5 - 4.0 c/s 001aai94 3 t reflow(peak) 250 230 217 t ( c) cooling rate preheat t 1 t 5 t 4 t 3 t 2 t (s) pemixcsp_fam all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 3 february 2011 13 of 16 nxp semiconductors pemixcsp family 4-, 6- and 8-channel passive filter network with esd protection 11. revision history table 13. revision history document id release date data sheet status change notice supersedes pemixcsp_fam v.1 20110203 product data sheet - - pemixcsp_fam all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 3 february 2011 14 of 16 nxp semiconductors pemixcsp family 4-, 6- and 8-channel passive filter network with esd protection 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 12.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 12.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification. pemixcsp_fam all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 3 february 2011 15 of 16 nxp semiconductors pemixcsp family 4-, 6- and 8-channel passive filter network with esd protection non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 12.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 13. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com nxp semiconductors pemixcsp family 4-, 6- and 8-channel passive filter network with esd protection ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 3 february 2011 document identifier: pemixcsp_fam please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 14. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 2.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 application information. . . . . . . . . . . . . . . . . . . 5 7.1 insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.2 use cases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.3 lcd interfaces, medium-speed interfaces . . . . 6 7.4 keypad, low-speed interfaces. . . . . . . . . . . . . . 6 8 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 design and assembly recommendations . . . 11 10.1 pcb design guidelines . . . . . . . . . . . . . . . . . . 11 10.2 pcb assembly guidelines for pb-free soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 12 legal information. . . . . . . . . . . . . . . . . . . . . . . 14 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 12.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 12.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 13 contact information. . . . . . . . . . . . . . . . . . . . . 15 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 |
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